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Methods of fabricating microneedle arrays using sacrificial molds, and microneedle arrays fabricated thereby

机译:使用牺牲模具制造微针阵列的方法,以及由此制造的微针阵列

摘要

Microneedle arrays are fabricated by providing a sacrificial mold including a substrate and an array of posts, preferably solid posts, projecting therefrom. A first material is coated on the sacrificial mold including on the substrate and on the array of posts. The sacrificial mold is removed to provide an array of hollow tubes projecting from a base. The inner and outer surfaces of the array of hollow tubes are coated with a second material to create the array of microneedles projecting from the base. The sacrificial mold may be fabricated by fabricating a master mold, including an array of channels that extend into the master mold from a face thereof. A third material is molded into the channels and on the face of the master mold, to create the sacrificial mold. The sacrificial mold then is separated from the master mold. Alternatively, wire bonding may be used to wire bond an array of wires to a substrate to create the sacrificial mold. The first material preferably is coated on the sacrificial mold by plating. Prior to plating, a plating base preferably is formed on the sacrificial mold including on the substrate and on the array of posts. The inner and outer surfaces of the array of hollow tubes preferably are coated with the second material by overplating the second material on the inner and outer surfaces of the array of hollow tubes.
机译:通过提供一种牺牲模具来制造微针阵列,该牺牲模具包括基体和从基体上伸出的多个柱,优选为实心柱。将第一材料涂覆在牺牲模具上,包括在基板上和在柱阵列上。去除牺牲模具以提供从基座突出的一系列中空管。中空管阵列的内表面和外表面涂有第二种材料,以形成从基部伸出的微针阵列。可以通过制造母模来制造牺牲模,该母模包括从其表面延伸到母模中的通道的阵列。将第三种材料模制到通道中,并在主模的表面上模制成牺牲模。然后将牺牲模具与母模分离。或者,可以使用引线键合将引线的阵列引线键合到衬底上,以形成牺牲模子。优选通过电镀将第一材料涂覆在牺牲模具上。在镀覆之前,优选在牺牲模具上包括在基板上和在柱阵列上形成镀覆基体。中空管阵列的内表面和外表面优选通过在中空管阵列的内表面和外表面上过度镀覆第二材料而涂覆有第二材料。

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