Printed wiring board having plurality of conductive patterns passing through adjacent pads, circuit component mounted on printed wiring board and circuit module containing wiring board with circuit component mounted thereon

摘要

A printed wiring board comprises a substrate having a packaging area to mount a circuit component, a plurality of pads arranged in a grid on the packaging area of the substrate, and a plurality of conductive patterns connected to the pads. At least a few of the pads located at the periphery of the packaging area are made smaller than those located inside.