首页> 外国专利> Optical communication module with one or more photonic integrated circuit (PIC) chips and an external booster optical amplifier for photonic integrated circuits (PICs)

Optical communication module with one or more photonic integrated circuit (PIC) chips and an external booster optical amplifier for photonic integrated circuits (PICs)

机译:具有一个或多个光子集成电路(PIC)芯片和用于光子集成电路(PIC)的外部增强型光放大器的光通信模块

摘要

A C- and/or L-band booster optical amplifier is utilized at the output of a semiconductor transmitter photonic integrated circuit (TxPIC) chip or the optical combined outputs of multiple semiconductor transmitter photonic integrated circuit (TxPIC) chips employed in an optical communication module, the deployment of integrated semiconductor optical amplifiers (SOAs) on th TxPIC chips can be eliminated. This would reduce both the complexity in designing and fabricating these chips as well as reducing the power consumption of the TxPIC chips. The deployment of such a Tx booster optical amplifier would also take into consideration the nonlinear effects of difficult high loss single mode fiber (SMF) or other fiber type links by allowing a higher power per channel to be achieved compared to the case where channel amplification is attempted solely on the TxPIC chip.
机译:在半导体发射器光子集成电路(TxPIC)芯片的输出或光通信模块中采用的多个半导体发射器光子集成电路(TxPIC)芯片的光学组合输出处使用C和/或L波段增强光放大器,可以消除在TxPIC芯片上部署集成半导体光放大器(SOA)的情况。这将降低设计和制造这些芯片的复杂度,并降低TxPIC芯片的功耗。这种Tx增强型光放大器的部署还将通过允许与通道放大相比具有更高的每个通道功率来考虑困难的高损耗单模光纤(SMF)或其他光纤类型链路的非线性影响。仅在TxPIC芯片上尝试。

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