A soft X-ray reduction projection exposure system includes a light source for generating a soft X-ray beam of a wavelength of a 4 through 20 nm band; a reflecting mask on which a desired pattern is formed; an illumination optical system for irradiating the reflecting mask with the soft X-ray beam; a reduction projection optical system for imaging the pattern of the reflecting mask on a wafer; and a controlling section for controlling a partial pressure of a gas of a carbon compound to be 1.33×10−8 Pa or less in at least one of a first region where the illumination optical system is disposed, a second region where the reflecting mask is disposed and a third region where the reduction projection optical system is disposed.
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