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Functional Sn-Bi alloy plating using a substitute material for Pb
Functional Sn-Bi alloy plating using a substitute material for Pb
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机译:使用替代Pb的功能性Sn-Bi合金电镀
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摘要
The present invention relates to a to-be-mounted electronic component to which functional alloy plating using a bonding material for mounting is applied with a substitute bonding material for solder (tin-lead alloy), and aims at providing alloy plating which has been put to a practical use in such a way that the function of existing alloy plating of this type has been significantly improved to eliminate toxic plating from various kinds of electronic components for use in electronic devices so that it is useful in protecting the environment.
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