首页>
外国专利>
Functional alloy plating using substitute bonding material for Pb and electronic component to be mounted to which the functional alloy plating is applied
Functional alloy plating using substitute bonding material for Pb and electronic component to be mounted to which the functional alloy plating is applied
展开▼
机译:使用用于Pb的替代结合材料和要安装功能合金镀层的电子元件进行功能合金镀层
展开▼
页面导航
摘要
著录项
相似文献
摘要
The present invention relates to a to-be-mounted electronic component to which functional alloy plating using a bonding material for mounting is applied with a substitute bonding material for solder (tin-lead alloy), and aims at providing alloy plating which has been put to a practical use in such a way that the function of existing alloy plating of this type has been significantly improved to eliminate toxic plating from various kinds of electronic components for use in electronic devices so that it is useful in protecting the environment.
展开▼