Method of manufacturing a cavity-down plastic ball grid array (CD-PBGA) substrate

摘要

An organic substrate and a heat spreader are separately made, and are then combined with a partially cured liquid-type adhesive layer. In making the organic substrate, a solder mask and a cavity as a pocket for an IC die are first formed on one side of an organic substrate. A pre-treatment process is performed to a copper layer on the opposite side of the organic substrate. A black ink layer is layered on one side of the heat spreader, and a second black ink layer is formed within a predetermined area on its opposite side. The predetermined area is reserved for positioning the IC die, and has a plurality of heat dissipating pads. A liquid-type adhesive printing process and a partial curing process are performed, which forms a solidified liquid-type adhesive layer outside of the predetermined area. The organic substrate is then laminated to the Cu heat spreader under high temperatures. Finally, a Ni/Au layer is plated onto a plurality of conductive pads and heat dissipating pads of the substrate.