首页>
外国专利>
Method and apparatus to achieve bond pad crater sensing and stepping identification in integrated circuit products
Method and apparatus to achieve bond pad crater sensing and stepping identification in integrated circuit products
展开▼
机译:在集成电路产品中实现键合压痕坑检测和台阶识别的方法和装置
展开▼
页面导航
摘要
著录项
相似文献
摘要
Method for stepping identification and bond pad crater jeopardy identification in integrated circuits and apparatus which performs the method, A unique device, a polysilicon meander, is formed under each bond pad in the integrated circuit device. Connected to the meander is circuitry for determining the electrical, and hence mechanical, integrity of the meander. Failure of the meander by reason of microcrack formation in the several layers under the meander is detected by the high resistance of the meander. The circuitry will also resolve any potential mismatch between the actual mask revision of the integrated circuit and the corresponding revision of the test program.
展开▼