首页> 外国专利> Niobium or vanadium substituted strontium titanate barrier intermediate a silicon underlayer and a functional metal oxide film

Niobium or vanadium substituted strontium titanate barrier intermediate a silicon underlayer and a functional metal oxide film

机译:铌或钒取代的钛酸锶锶阻挡层,位于硅底层和功能性金属氧化物膜中间

摘要

A ferroelectric memory cell formed on a monocrystalline silicon underlayer, either an epitaxial silicon contact plug to a transistor source or drain or silicon gate region for which the memory cell forms a non-volatile gate. A conductive barrier layer of vanadium or niobium substituted strontium titanate is epitaxially grown over the silicon, and a lower metal oxide electrode layer, a ferroelectric layer and an upper metal oxide electrode layer are epitaxially grown on the barrier layer. No platinum barrier is needed beneath the ferroelectric stack. The invention can be applied to many other functional oxide devices including micromachined electromechanical (MEM) devices and ferromagnetic tri-layer devices.
机译:在单晶硅底层上形成的铁电存储单元,或者是外延硅接触插塞到晶体管的源极或漏极或硅栅极区域,存储单元为此形成了非易失性栅极。在硅上外延生长钒或铌取代的钛酸锶锶的导电阻挡层,并且在阻挡层上外延生长下金属氧化物电极层,铁电层和上金属氧化物电极层。在铁电叠层下面不需要铂阻挡层。本发明可以应用于许多其他功能性氧化物器件,包括微机械机电(MEM)器件和铁磁三层器件。

著录项

  • 公开/公告号US6518609B1

    专利类型

  • 公开/公告日2003-02-11

    原文格式PDF

  • 申请/专利权人 UNIVERSITY OF MARYLAND;

    申请/专利号US20000652798

  • 发明设计人 RAMAMOORTHY RAMESH;

    申请日2000-08-31

  • 分类号H01L297/60;H01L299/40;H01L310/62;

  • 国家 US

  • 入库时间 2022-08-22 00:06:53

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