首页>
外国专利>
Method to deposit a seeding layer for electroless copper plating
Method to deposit a seeding layer for electroless copper plating
展开▼
机译:沉积用于化学镀铜的籽晶层的方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
A method of for electroless copper deposition using a Pd/Pd acetate seeding layer formed in using only two components (Pd acetate and solvent) to form an interconnect for a semiconductor device. The invention has two preferred embodiments. The first embodiment forms a Key seed layer composed of Pd/Pd acetate by a spin-on or dip process for the electroless plating of a Cu plug. The second embodiment forms a Pd passivation cap layer over the Cu plug to prevent the Cu plug from oxidizing.
展开▼