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Method of manufacturing a double-heterojunction bipolar transistor on III-V material

机译:在III-V材料上制造双异质结双极晶体管的方法

摘要

The invention relates to a method of manufacturing a double heterojunction bipolar transistor (1) comprising successively at least one sub-collector layer, a collector layer, a base layer and a metallic layer (10) deposited on the said base layer; the said metallic layer (10) being extended towards a contact pad (110) of the base by an underetched metallic “air bridge” (100), characterized in that producing the said “air bridge” (100) includes the following steps:;effecting a first localized etching under the said bridge, this first etching being selective so as to etch the sub-collector layer laterally; and;effecting a second localized etching under the said bridge, this second etching being selective so as to vertically etch at least the collector layer.
机译:本发明涉及一种制造双异质结双极晶体管( 1 )的方法,该双异质结双极晶体管依次包括至少一个子集电极层,集电极层,基极层和金属层( 10 < / B>)沉积在所述基础层上;所述金属层( 10 )通过未蚀刻的金属“气桥”延伸至基底的接触垫( 110 )。 ( 100 ),其特征在于,生成所述“空中桥梁” ( 100 )包括以下步骤:在所述桥下进行第一局部蚀刻,该第一蚀刻是选择性的,以便横向蚀刻子集电极层。在所述桥下进行第二局部蚀刻,该第二蚀刻是选择性的,以便至少垂直地蚀刻所述集电极层。

著录项

  • 公开/公告号US6495869B2

    专利类型

  • 公开/公告日2002-12-17

    原文格式PDF

  • 申请/专利权人 ALCATEL;

    申请/专利号US20010781275

  • 申请日2001-02-13

  • 分类号H01L297/37;

  • 国家 US

  • 入库时间 2022-08-22 00:06:26

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