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Semiconductor wafer cleaning method to remove residual contamination including metal nitride particles
Semiconductor wafer cleaning method to remove residual contamination including metal nitride particles
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机译:半导体晶片清洗方法以去除包括金属氮化物颗粒的残留污染物
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摘要
A method of removing residual contamination including metal nitride particles from semiconductor wafer surfaces including the steps of: providing at least one semiconductor wafer with metal nitride particles adhering to the at least one semiconductor wafer surface thereto; subjecting the at least one semiconductor wafer to at least one mechanical brushing process while a cleaning solution including a carboxylic acid is supplied to at least one semiconductor wafer surface; and, subjecting the at least one semiconductor wafer to an a sonic cleaning process including the carboxylic acid cleaning solution.
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