首页>
外国专利>
Microelectronic fabrication having formed therein terminal electrode structure providing enhanced barrier properties
Microelectronic fabrication having formed therein terminal electrode structure providing enhanced barrier properties
展开▼
机译:在其中形成了提供增强的阻挡性能的终端电极结构的微电子制造
展开▼
页面导航
摘要
著录项
相似文献
摘要
Within both a method for fabricating a microelectronic fabrication, and the microelectronic fabrication fabricated employing the method, there is first provided a substrate. Within the method, there is then formed over the substrate a patterned bond pad layer. There is then formed over the patterned bond pad layer a barrier layer comprising: (1) a first titanium-tungsten alloy layer; (2) a titanium-tungsten alloy nitride layer formed upon the first titanium-tungsten alloy layer; and (3) a second titanium-tungsten alloy layer formed upon the titanium-tungsten alloy nitride layer. Finally, there is then formed upon the barrier layer a seed layer which comprises a titanium layer formed upon the barrier layer. The method contemplates a microelectronic fabrication fabricated employing the method. The barrier layer provides enhanced barrier properties within the microelectronic fabrication within which is formed the barrier layer.
展开▼