首页> 外国专利> ELECTRONIC DEVICE HAVING DEWING PREVENTION STRUCTURE AND DEWING PREVENTION STRUCTURE OF ELECTRONIC DEVICE

ELECTRONIC DEVICE HAVING DEWING PREVENTION STRUCTURE AND DEWING PREVENTION STRUCTURE OF ELECTRONIC DEVICE

机译:具有防结露结构的电子设备和防结露结构的电子设备

摘要

The electronic device includes a semiconductordevice, a substrate on which the semiconductor device ismounted, a flange member for holding a peripheralportion of the substrate and a cooling member, in whichthe flange member for supporting the substrate of thesemiconductor device being thermally in contact with thecooling member is arranged to come into contact with aheater through an adapter and between the heater and thecooling member, a heat insulating material is filled.
机译:该电子设备包括半导体器件,半导体器件在其上的衬底已安装,用于固定外围设备的法兰部件基板的一部分和冷却构件,其中用于支撑基板的凸缘构件半导体器件与半导体器件热接触冷却构件布置成与通过适配器在加热器和加热器之间冷却构件中,填充有隔热材料。

著录项

  • 公开/公告号CA2387252A1

    专利类型

  • 公开/公告日2002-11-24

    原文格式PDF

  • 申请/专利权人 NEC CORPORATION;

    申请/专利号CA20022387252

  • 发明设计人 YOSHIKAWA MINORU;

    申请日2002-05-23

  • 分类号H01L23/34;H05K7/20;

  • 国家 CA

  • 入库时间 2022-08-21 23:58:41

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