Electronic device having dewing prevention structure

摘要

The electronic device includes a semiconductor device (1), a substrate (2) on which the semiconductor device (1) is mounted, a flange member (7) for holding a peripheral portion of the substrate (2) and a cooling member (3), in which the flange member (7) for supporting the substrate (2) of the semiconductor device being thermally in contact with the cooling member (3) is arranged to come into contact with a heater (5) through an adapter (6) and between the heater (5) and the cooling member (3), a heat insulating material is filled.