首页> 外国专利> METHOD FOR APPLYING A SILVER SOLDER TO A TOOTH IN A SOLDER DEVICE

METHOD FOR APPLYING A SILVER SOLDER TO A TOOTH IN A SOLDER DEVICE

机译:在焊锡装置中将银焊锡应用于牙齿的方法

摘要

In a method for applying a silver solder on a tooth 14 in a anlötvorrichtung, which is operated with a round table 10, a silver solder platelet in a silver solder - cutting station 16 is cut off, and on the round table 10 of the shape of the tooth 14 postformed. The silver solder platelets is deformed by means of a gripper 17 via the round table 10 is lifted and the tooth 14, upon rotation of the round table 10 transported under the deformed silver solder platelet. The silver solder platelet, in a predetermined spacing on the tooth 14 thereon and then a further second flow supplied to means station 18. From there, the round table 10 the tooth 14 with the wetted silberlotplätchen on both sides in a soldering station 19, in which the tooth on a base body is soldered.
机译:在将银焊料施加到圆桌10上操作的牙齿上的牙齿14上的方法中,将银焊料-切割站16中的银焊料薄片切掉,并在形状为圆形的圆桌10上齿14的后成形。借助夹具17,经由圆桌10将银焊料片变形,并且在圆桌10的旋转下,齿14在变形的银焊料片下运输,从而使齿14旋转。该银焊料片以预定的间隔在其上的齿14上,然后再向工件台18提供第二次流动。从那里,圆台10上的齿14在焊接台19的两侧都带有润湿的silberlotplätchen。焊接在基体上的牙齿。

著录项

  • 公开/公告号EP1274532A1

    专利类型

  • 公开/公告日2003-01-15

    原文格式PDF

  • 申请/专利权人 GERLING AUTOMATION GMBH;

    申请/专利号EP20010940125

  • 发明设计人 GERLING HOLGER;

    申请日2001-04-04

  • 分类号B23K1/00;B23K37/04;

  • 国家 EP

  • 入库时间 2022-08-21 23:50:44

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