Optical package substrate, optical device, optical module, and method for molding optical package substrate

摘要

Although press formation is a process capable of mass-producing components of the same shape at low cost, conventional die processing using a microgrinder has a poor applicability because it can only do as much as molding V grooves for guiding optical fibers. Microdischarge machining is employed to obtain a die that has been difficult to obtain with a grinding process using a microgrinder, and an optical package substrate is produced by press formation using such a die. Thus, an optical fiber, an optical waveguide, a lens, an isolator, an optical filter and a light receiving/emitting element can be mounted by passive alignment, whereby optical devices and optical modules with multiple functions can be mass-produced at low cost.