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Optical package substrate, optical device, optical module, and method for molding optical package substrate
Optical package substrate, optical device, optical module, and method for molding optical package substrate
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机译:光学封装基板,光学装置,光学模块以及光学封装基板的成型方法
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摘要
Micro-discharge machining is employed to obtain a die, and an optical package substrate is produced by press formation using such a die. An optical fiber, an optical waveguide, a lens, an isolator, an optical filter and a light receiving/emitting element are mounted by passive alignment.
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