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Memory embedded logic integrated circuit mounting memory circuits having different performances on the same chip

机译:存储器嵌入式逻辑集成电路将具有不同性能的存储器电路安装在同一芯片上

摘要

A semiconductor integrated circuit includes a first DRAM circuit (13-1) having a first memory cell array having a plurality of memory cells each including a first MOS transistor, and a first potential generating circuit which generates at least one potential used to operate the plurality of memory cells in the first memory cell array, the first DRAM circuit being formed in a semiconductor chip (11), and a second DRAM circuit (13-2) having a second memory cell array having a plurality of memory cells each including a second MOS transistor different in characteristic from the first MOS transistor, and a second potential generating circuit which generates at least one potential used to operate the plurality of memory cells in the second memory cell array, the second DRAM circuit being formed in the semiconductor chip.
机译:半导体集成电路包括:第一DRAM电路(13-1),其具有第一存储器单元阵列,该第一存储器单元阵列具有多个存储器单元,每个存储器单元包括第一MOS晶体管;以及第一电势产生电路,该电路产生至少一个用于操作多个电势的电势。第一存储单元阵列中的多个存储单元中的一个,第一DRAM电路形成在半导体芯片(11)中,第二DRAM电路(13-2)具有第二存储单元阵列,第二存储单元阵列具有多个存储单元,每个存储单元包括第二存储单元。特性不同于第一MOS晶体管的MOS晶体管,以及第二电位产生电路,该第二电位产生电路产生用于操作第二存储单元阵列中的多个存储单元的至少一个电位,第二DRAM电路形成在半导体芯片中。

著录项

  • 公开/公告号EP1349174A2

    专利类型

  • 公开/公告日2003-10-01

    原文格式PDF

  • 申请/专利权人 KABUSHIKI KAISHA TOSHIBA;

    申请/专利号EP20020011553

  • 申请日2002-05-24

  • 分类号G11C11/401;G11C11/4074;G11C11/4094;G11C11/408;G11C7/12;

  • 国家 EP

  • 入库时间 2022-08-21 23:48:54

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