首页> 外国专利> METHOD FOR PREPARING BISMUTH OXIDE THIN FILMS BY METAL-ORGANIC CHEMICAL VAPOR DEPOSITION

METHOD FOR PREPARING BISMUTH OXIDE THIN FILMS BY METAL-ORGANIC CHEMICAL VAPOR DEPOSITION

机译:金属有机化学气相沉积法制备氧化铋薄膜的方法

摘要

PURPOSE: A method for manufacturing a Bi2O3 thin film by metal-organic chemical vapor deposition(MOCVD) is provided to produce a large quantity of the Bi2O3 thin film under the condition of low or ambient pressure and temperature of 200 degree Celsius to 700 degree Celsius, pouring Bi-containing organic metal and oxygen-containing gas or organic material through separate supplying lines. CONSTITUTION: A Bi2O3 thin film is grown on each material such as SiO2, Si, Al2O3 (0001) and Al2O3 (1100), using MOCVD facility shown in the figure. (CH3)3Bi and O2 are employed as reaction material and Ar gas is used as a transporting one. Each of them is poured through the separate lines. While the thin film is being grown for an hour, the pressure and temperature inside a reactor are preserved at 760mmHg and 500 degree Celsius respectively and the speed of the gas flow is adjusted to 100sccm for Ar gas, 5 to 10sccm for (CH3)3Bi and 40 to 50sccm. After growing, the thin film is processed thermally at 75 degree Celsius under the oxygen ambient.
机译:目的:提供一种通过金属有机化学气相沉积(MOCVD)制造Bi 2 O 3薄膜的方法,以在低压或环境压力和200摄氏度至700摄氏度的温度下生产大量Bi 2 O 3薄膜。然后,通过单独的供应管线注入含Bi的有机金属和含氧的气体或有机材料。组成:使用图中所示的MOCVD设备,在SiO2,Si,Al2O3(0001)和Al2O3(1100)等每种材料上生长Bi2O3薄膜。 (CH 3)3 Bi和O 2被​​用作反应材料,并且Ar气被用作传输气体。它们每个都通过单独的线注入。在薄膜生长一个小时的过程中,反应器内部的压力和温度分别保持在760mmHg和500摄氏度,氩气的气流速度调整为100sccm,(CH3)3Bi的气流速度调整为5-10sccm 40至50sccm。生长后,在氧气环境下以75摄氏度对薄膜进行热处理。

著录项

  • 公开/公告号KR20020088128A

    专利类型

  • 公开/公告日2002-11-27

    原文格式PDF

  • 申请/专利权人 POSTECH FOUNDATION;

    申请/专利号KR20010027038

  • 发明设计人 KIM DONG HYEOK;LEE GYU CHEOL;

    申请日2001-05-17

  • 分类号H01L21/205;

  • 国家 KR

  • 入库时间 2022-08-21 23:48:33

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号