Manufacturing method for printed circuit board which having progressed leakage current characteristic

摘要

PURPOSE: A method for manufacturing a PCB(Printed Circuit Board) having an improved leakage current characteristic is provided to improve a characteristic of leakage current due to impurities in a bonding process between substrates. CONSTITUTION: The first and the second PCBs having the first and the second circuit patterns are prepared(30). The first and the second PCBs are formed on an upper face and a lower face of a probe card. The first and the second PCBs are formed with an FR4 material. The first and the second PCBs are bonded by using a sheet type adhesive. At this time, the first pattern of the first PCB is located at an opposite side to the second pattern of the second PCB. The bonded PCBs are firmly bonded by performing a thermal process(31). The first and the second patterns of the first and the second PCBs are connected to each other(32). The moisture and impurities are removed from a junction portion between the first and the second PCBs by performing a baking process(33).