Post exposure bake apparatus and post exposure bake method using the same

摘要

PURPOSE: A post exposure bake apparatus and a post exposure bake method using the same are provided to be capable of preventing the abrupt temperature change of a semiconductor wafer coated with an exposed photoresist layer in a chamber by conserving vacuum state under a bake process using a vacuum pump. CONSTITUTION: A hot plate(105) is installed in the lower portion of a chamber(101) for loading a wafer coated with an exposed photoresist layer. A wafer guide is installed at both edge portion of the hot plate for guiding and separating the wafer from the bottom portion of the hot plate. A shutter(109) is located at one side of the chamber for switching the chamber. A vacuum pump(119) is connected through a vacuum line(115) to the chamber for conserving the vacuum state of the chamber. A plurality of support pins(113) are located in through holes of the hot plate for moving the wafer up and down. A gas injecting line(116) is connected with the upper portion of the chamber for supplying inert gas.