首页> 外国专利> REGENERATING PROCESS AND REGENERATING SYSTEM TO REGENERATE WASTE SLURRY FROM SEMICONDUCTOR WAFER MANUFACTURING PROCESS

REGENERATING PROCESS AND REGENERATING SYSTEM TO REGENERATE WASTE SLURRY FROM SEMICONDUCTOR WAFER MANUFACTURING PROCESS

机译:再生工艺和再生系统以再生半导体晶圆制造工艺中的废渣

摘要

PURPOSE: A regenerating process and a regenerating system to regenerate waste slurry from semiconductor wafer manufacturing process are provided to remarkably decrease the quantity of slurry consumed in the semiconductor fabricating process by recycling more 90 percent of used slurry periodically generated in the semiconductor wafer fabricating process. CONSTITUTION: Waste slurry is agitated to spread out a deposit composed of a polishing agent and a cutting material. The agitated slurry is mixed with recycled oil to dilute the agitated slurry. The waste slurry is firstly centrifuged to extract the polishing agent. The first oil centrifuged in the first centrifugal process is secondly centrifuged to generate the second oil and a cutting material. The second oil is filtered by using a filter(60) and is refined and reduced to recycled oil.
机译:用途:提供了一种再生工艺和一种再生系统,用于再生半导体晶圆制造工艺中产生的废浆料,通过回收在半导体晶圆制造工艺中定期产生的90%以上的废浆料,来显着减少半导体制造工艺中消耗的浆料数量。组成:搅动废浆以散布由抛光剂和切削材料组成的沉积物。将搅拌的浆料与再循环的油混合以稀释搅拌的浆料。首先将废浆液离心以提取抛光剂。在第一离心过程中离心的第一油被第二次离心以产生第二油和切削材料。通过使用过滤器(60)过滤第二种油,然后将其精炼并还原为再循环油。

著录项

  • 公开/公告号KR100393007B1

    专利类型

  • 公开/公告日2003-07-31

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20010040930

  • 发明设计人 권태일;

    申请日2001-07-09

  • 分类号H01L21/304;

  • 国家 KR

  • 入库时间 2022-08-21 23:45:13

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