REGENERATING PROCESS AND REGENERATING SYSTEM TO REGENERATE WASTE SLURRY FROM SEMICONDUCTOR WAFER MANUFACTURING PROCESS

摘要

There are provided a method and a system for regenerating a waste slurry which is disused after a slurry has been used to raise the cutting efficiency in a process of fabricating various wafers, such as semiconductor wafers, solar wafers and others. The method for regenerating the waste slurry made during various wafer fabrication processes comprises: a waste slurry mixing step (S10) of mixing a waste slurry, to disperse abrasives and chips contained in the waste slurry; a dispersing step (S20) of dispersing the waste slurry mixed in the mixing step, by using ultrasonic waves; a centrifuging step (S30) of extracting abrasive solids from the waste slurry dispersed in the dispersing step, by using a centrifuge; an abrasive solid mixing step (S40) of mixing the abrasive solids extracted in the centrifuging step; an abrasive purifying step (S50) of purifying the abrasives mixed in the mixing step, by using an abrasive purifier; a drying step (S60) of removing moisture of the abrasive solids purified in the abrasive purifying step; and a regenerating step (S70) of processing the abrasives dried in the drying step, to be in a powder state. The system for regenerating a waste slurry made during various wafer fabrication processes comprises: a waste slurry mixer (10) for mixing a waste slurry being put into the mixer (10), to scatter a precipitate composed of abrasives and chips included in the waste slurry; a particle disperser (20) for dispersing the mixed waste slurry flowing from the mixer (10), by using ultrasonic waves; a centrifuge (30) for centrifuging the waste slurry dispersed by the particle disperser (20), to extract the abrasives; a number of sub-tanks (40) for storing the abrasives extracted by the centrifuge (30); a number of mixers (50) for mixing the abrasives of the sub-tanks (40); a number of abrasive purifiers (60), each including a cleaning device installed in the centrifuge, for removing impurities remaining on the abrasives by receiving the abrasives supplied from the mixers (50); a drier (70) for drying the abrasives purified by the abrasive purifiers (60); and an abrasive powder maker (80) for regenerating the abrasives dried by the drier (70).