首页> 外国专利> REGENERATING PROCESS AND REGENERATING SYSTEM TO REGENERATE WASTE SLURRY FROM SEMI-CONDUCTOR WAFER MANUFACTURING PROCESS

REGENERATING PROCESS AND REGENERATING SYSTEM TO REGENERATE WASTE SLURRY FROM SEMI-CONDUCTOR WAFER MANUFACTURING PROCESS

机译:再生过程和再生系统以再生半导体晶圆制造过程中的废渣

摘要

There are provided a method and a system for regenerating a waste slurry which is disused after a slurry has been used to raise the cutting efficiency in a process of fabricating various wafers, such as semiconductor wafers, solar wafers and others. The method for regenerating the waste slurry processes comprises: a waste slurry mixing step (S10) of mixing a waste slurry, to disperse abrasives and chips contained in the waste slurry; a dispersing step (S20) of dispersing the waste slurry mixed in the mixing step, by using ultrasonic waves; a centrifuging step (S30) of extracting abrasive solids from the waste slurry dispersed in the dispersing step, by using a centrifuge; an abrasive solid mixing step (S40) of mixing the abrasive solids extracted in the centrifuging step; an abrasive purifying step (S50) of purifying the abrasives mixed in the mixing step, by using an abrasive purifier; a drying step (S60) of removing moisture of the abrasive solids purified in the abrasive purifying step; and a regenerating step (S70) of processing the abrasives dried in the drying step, to be in a powder state. The system for regenerating a waste slurry made during various wafer fabrication processes comprises: a waste slurry mixer (10) for mixing a waste slurry being put into the mixer (10), to scatter a precipitate composed of abrasives and chips included in the waste slurry; a particle disperser (20) for dispersing the mixed waste slurry flowing from the mixer (10), by using ultrasonic waves; a centrifuge (30) for centrifuging the waste slurry dispersed by the particle disperser (20), to extract the abrasives; a number of sub-tanks (40) for storing the abrasives extracted by the centrifuge (30); a number of mixers (50) for mixing the abrasives of the sub-tanks (40); a number of abrasive purifiers (60), each including a cleaning device installed in the centrifuge, for removing impurities remaining on the abrasives by receiving the abrasives supplied from the mixers (50); a drier (70) for drying the abrasives purified by the abrasive purifiers (60); and an abrasive powder maker (80) for regenerating the abrasives dried by the drier (70).
机译:提供了一种用于再生废浆料的方法和系统,该废浆料在已经被使用以提高制造诸如半导体晶片,太阳能晶片等的各种晶片的过程中的切割效率之后被废弃。再生废浆过程的方法包括:混合废浆以分散废浆中所含的磨料和碎屑的废浆混合步骤(S 10 );和分散工序(S 20 )是利用超声波将在混合工序中混合的废浆料分散的工序。离心步骤(S 30 ),其通过使用离心机从分散步骤中分散的废浆中提取磨料固体;研磨固体混合步骤(S 40 ),用于混合在离心步骤中提取的研磨固体;通过使用磨料净化器来净化在混合步骤中混合的磨料的磨料净化步骤(S 50 );干燥步骤(S 60 ),其去除在磨料纯化步骤中纯化的磨料固体的水分;再生步骤(S 70 )将在干燥步骤中干燥的磨料加工成粉末状态。用于再生在各种晶片制造过程中制造的废浆的系统包括:废浆混合器( 10 ),用于混合放入混合器( 10 )中的废浆,分散由废浆中包含的磨料和碎屑组成的沉淀物;粒子分散器( 20 ),用于通过超声波分散从混合器( 10 )流出的混合废浆。离心机( 30 ),对由颗粒分散机( 20 )分散的废浆进行离心分离,以提取磨料;多个子容器( 40 )用于存储离心机( 30 )提取的磨料;许多混合器( 50 )用于混合子容器( 40 )的磨料;许多磨料净化器( 60 ),每个磨料净化器都包括一个安装在离心机中的清洁装置,用于通过接收混合器提供的磨料来清除残留在磨料上的杂质( 50 );干燥机( 70 )用于干燥由磨料净化器( 60 )净化的磨料;磨粉机( 80 )用于再生由干燥机( 70 )干燥的磨料。

著录项

  • 公开/公告号US2010186302A1

    专利类型

  • 公开/公告日2010-07-29

    原文格式PDF

  • 申请/专利权人 SEOUNG YOUNG LIM;SUNG SHIN KIM;

    申请/专利号US20080663333

  • 发明设计人 SEOUNG YOUNG LIM;SUNG SHIN KIM;

    申请日2008-03-20

  • 分类号C09K3/14;C09C1/68;G05D9/00;B01F13/00;B04B11/00;B01J19/00;C09C1/28;

  • 国家 US

  • 入库时间 2022-08-21 18:54:23

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