首页> 外国专利> A method for shielding a realized on a printed circuit board electrical circuit and a corresponding combination of a printed circuit board with a shield

A method for shielding a realized on a printed circuit board electrical circuit and a corresponding combination of a printed circuit board with a shield

机译:一种用于屏蔽印刷电路板上的电路的方法以及印刷电路板与屏蔽的相应组合

摘要

The invention relates to a method for shielding an electric circuit created on a printed circuit board (1), which comprises at least the following steps: a. covering of the printed circuit board (1) with an electrically insulating material (4) in such a way that at least the electric circuit created on the printed circuit board (1) is covered with the electrically insulating material (4) and at least one earthed location (6) on the printed circuit board (1) is left uncovered; b. application of an electrically conductive material (5), which acts as a shield, to the electrically insulating material (4) in such a way that at least the circuit created on the printed circuit board is covered with the electrically insulating material (4), to which the electrically conductive shielding material (5) has been applied; c. contacting of the electrically conductive shielding material (5) with the earthed location(s) (6) of the printed circuit board (1). The invention also relates to a combination of a printed circuit board (1), on which at least one electric circuit is created, and at least one shield (3) for said circuit(s). In said combination, at least the electric circuit created on the printed circuit board is provided with a first covering (4) of an electrically insulating material. A second covering (5) of an electrically conductive shielding material is applied to the first covering (4) of electrically insulating material, on the side that faces away from the electric circuit and the second covering (5) of electrically conductive shielding material is contacted with at least one earthed location (6) of the printed circuit board (1).
机译:本发明涉及一种用于屏蔽在印刷电路板(1)上形成的电路的方法,该方法至少包括以下步骤:a。用电绝缘材料(4)覆盖印刷电路板(1),使得至少在印刷电路板(1)上产生的电路被电绝缘材料(4)覆盖,并且至少一个印刷电路板(1)上的接地位置(6)未被遮盖; b。将一种用作屏蔽的导电材料(5)施加到电绝缘材料(4)上,使得至少在印刷电路板上形成的电路被电绝缘材料(4)覆盖,导电屏蔽材料(5)已涂在其上; C。导电屏蔽材料(5)与印刷电路板(1)的接地位置(6)接触。本发明还涉及印刷电路板(1)和至少一个用于所述电路的屏蔽(3)的组合,在印刷电路板(1)上形成至少一个电路。在所述组合中,至少在印刷电路板上形成的电路设置有电绝缘材料的第一覆盖物(4)。将导电屏蔽材料的第二覆盖层(5)涂覆在绝缘材料的第一覆盖层(4)上,该导电层位于背对电路的一侧,并且导电屏蔽材料的第二覆盖层(5)接触至少有一个接地的印刷电路板(1)的位置(6)。

著录项

  • 公开/公告号DE10125745A1

    专利类型

  • 公开/公告日2002-12-05

    原文格式PDF

  • 申请/专利权人 SIEMENS AG;

    申请/专利号DE2001125745

  • 发明设计人 ROMAHN JOERG;

    申请日2001-05-21

  • 分类号H05K9/00;

  • 国家 DE

  • 入库时间 2022-08-21 23:43:00

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