Cooling system for heat-generating semiconductor component e.g. for vehicle brake control system, has hollow heat pipe extending between component and heat sink body

摘要

The cooling system (1) has a metallic heat pipe (3), with an internal hollow space (4), coupled to the heat-generating semiconductor component (12) at one side and to a heat sink body (2) at the other side. A filling opening (5) provided with a closure (6) is used for filling the internal hollow space of the heat pipe with a liquid. An Independent claim for a method for assembly of a cooling system for a heat-generating semiconductor component is also included.