首页> 外国专利> Forming micro-cavities with optically-transparent walls, produces silicon region surrounded by transparent etch-resist with hole permitting silicon removal by etching

Forming micro-cavities with optically-transparent walls, produces silicon region surrounded by transparent etch-resist with hole permitting silicon removal by etching

机译:形成具有光透明壁的微腔,产生被透明蚀刻抗蚀剂包围的硅区域,该区域具有允许通过蚀刻去除硅的孔

摘要

A silicon region (7) is produced. This is surrounded on all sides by an optically-transparent covering layer (2, 5). An opening (6) is formed in the covering layer. The silicon (7) surrounded by the covering layer, is dissolved-out through the opening, the layer acting as an etch-resist.
机译:产生硅区域(7)。它在所有侧面都被光学透明的覆盖层(2、5)包围。在覆盖层中形成开口(6)。被覆盖层包围的硅(7)通过该开口溶出,该层起抗蚀剂的作用。

著录项

  • 公开/公告号DE10149139A1

    专利类型

  • 公开/公告日2003-04-24

    原文格式PDF

  • 申请/专利权人 ROBERT BOSCH GMBH;

    申请/专利号DE2001149139

  • 申请日2001-10-05

  • 分类号B81C1/00;

  • 国家 DE

  • 入库时间 2022-08-21 23:42:39

相似文献

  • 专利
  • 外文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号