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Forming micro-cavities with optically-transparent walls, produces silicon region surrounded by transparent etch-resist with hole permitting silicon removal by etching
Forming micro-cavities with optically-transparent walls, produces silicon region surrounded by transparent etch-resist with hole permitting silicon removal by etching
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机译:形成具有光透明壁的微腔,产生被透明蚀刻抗蚀剂包围的硅区域,该区域具有允许通过蚀刻去除硅的孔
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摘要
A silicon region (7) is produced. This is surrounded on all sides by an optically-transparent covering layer (2, 5). An opening (6) is formed in the covering layer. The silicon (7) surrounded by the covering layer, is dissolved-out through the opening, the layer acting as an etch-resist.
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