首页> 外国专利> Circuit board fitted or for fitting with components, has shape memory alloy element(s) that adopts imposed shape depending on temperature to deform board

Circuit board fitted or for fitting with components, has shape memory alloy element(s) that adopts imposed shape depending on temperature to deform board

机译:装配或用于装配元件的电路板,其形状记忆合金元件根据温度采用外加形状使板变形

摘要

The circuit board (1) has at least one element (4) made of a shape memory alloy that adopts an imposed shape depending on the temperature and with whose change in shape the circuit board can be deformed. The whole circuit board consists of a flexible material or it has rigid sections connected by flexible connecting sections. AN Independent claim is also included for the following: a method of manufacturing an inventive device.
机译:电路板(1)具有至少一个由形状记忆合金制成的元件(4),该形状记忆合金根据温度而采用所施加的形状,并且随着形状的改变,电路板可以变形。整个电路板由柔性材料组成,或者具有通过柔性连接部分连接的刚性部分。还包括以下内容的独立权利要求:一种制造本发明装置的方法。

著录项

  • 公开/公告号DE10151242A1

    专利类型

  • 公开/公告日2003-05-08

    原文格式PDF

  • 申请/专利权人 SIEMENS AG;

    申请/专利号DE2001151242

  • 发明设计人 ZEININGER HEINZ;KAUTZ STEFAN;

    申请日2001-10-17

  • 分类号H05K1/02;H05K13/00;

  • 国家 DE

  • 入库时间 2022-08-21 23:42:30

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