METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD ON WHICH LATTICE SHAPE ELECTRODE ARRAY TYPE COMPONENT IS MOUNTED, AND PRINTED CIRCUIT BOARD ON WHICH LATTICE SHAPE ELECTRODE ARRAY TYPE COMPONENT IS MOUNTED

摘要

PROBLEM TO BE SOLVED: To reduce a solder void generated when a lattice shape electrode array type component is mounted on a printed wiring board.;SOLUTION: A copper foil pad is provided on a surface of a printed wiring board for mounting a lattice shape electrode array type component. An opening part is provided in the copper foil pad. A copper foil pad is provided also on the back face. Solder paste printing is performed on the surface including the opening part of the surface of the printed wiring board. The lattice shape electrode array type component is mounted on the solder paste printing face. Solder paste is melted by reflow hot air. Thus, the printed wiring board and the lattice shape electrode array type component are connected by the solder.;COPYRIGHT: (C)2012,JPO&INPIT