首页> 外国专利> Hard-soldering method, e.g. for metallic exhaust catalyst substrate honeycomb, involves pre-cleaning stage, and removes solder grains adhering outside desired soldering boundary

Hard-soldering method, e.g. for metallic exhaust catalyst substrate honeycomb, involves pre-cleaning stage, and removes solder grains adhering outside desired soldering boundary

机译:硬焊方法,例如用于金属排气催化剂基质蜂窝,包括预清洁阶段,并去除附着在所需焊接边界之外的焊锡颗粒

摘要

Before soldering, for which adhesive and solder powder are introduced into the joint, a cleaning stage is performed. Solder grains are removed where they project beyond the soldering boundary defining the desired soldering region (2). The metal assembly is first constructed using smooth, structured metal sheets (9). Channels (10) are bounded by V-sections (11), into which the soldering regions extend.
机译:在焊接之前,将粘合剂和焊粉引入接头中,然后执行清洁步骤。焊锡颗粒超出了限定所需焊接区域(2)的焊接边界的位置时,将其去除。首先使用光滑的结构化金属板(9)构造金属组件。通道(10)由V形部分(11)界定,焊接区域延伸到其中。

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