Solder metallization i.e. gold-tin solder metallization, producing method for e.g. silicon substrate, involves removing current transport layer of metallization compound outside contact surface

摘要

The method involves applying a metallization compound comprising a current transport layer on a surface (1') of a substrate (1). A photoresist is applied on the metallization compound. A contact surface is formed by partial removal of the current transport layer. Another metallization compound is applied on the contact surface. The latter metallization compound is structured by a lift-off process. A solder metallization at the latter metallization compound is galvanically separated. The current transport layer of the former metallization compound is removed outside the contact surface.