首页> 外国专利> Bitline contact plug formation method for flash memory manufacture, involves forming contact hole in inter-layered dielectric layer that covers conductive layer and fills gap between respective gate conducting structures

Bitline contact plug formation method for flash memory manufacture, involves forming contact hole in inter-layered dielectric layer that covers conductive layer and fills gap between respective gate conducting structures

机译:用于闪存制造的位线接触塞形成方法,包括在层间介电层中形成接触孔,该层覆盖导电层并填充各个栅极导电结构之间的间隙

摘要

An inter-layered dielectric (ILD) layer (72) with planarized surface, is formed on a semiconductor substrate (50) comprising gate conducting structures, to cover a conductive layer and to fill gap between respective conducting structures. A bitline contact hole formed in the ILD layer, is filled with a conductive layer, to function as bitline contact plug.
机译:具有平坦化表面的层间电介质(ILD)层(72)形成在包括栅极导电结构的半导体衬底(50)上,以覆盖导电层并填充各个导电结构之间的间隙。在ILD层中形成的位线接触孔填充有导电层,以用作位线接触塞。

著录项

  • 公开/公告号DE10206149C1

    专利类型

  • 公开/公告日2003-09-25

    原文格式PDF

  • 申请/专利权人 PROMOS TECHNOLOGIES INC.;

    申请/专利号DE2002106149

  • 发明设计人 PENG HSIN-TANG;

    申请日2002-02-14

  • 分类号H01L21/283;H01L21/768;H01L21/8247;

  • 国家 DE

  • 入库时间 2022-08-21 23:42:09

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