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Bitline contact plug formation method for flash memory manufacture, involves forming contact hole in inter-layered dielectric layer that covers conductive layer and fills gap between respective gate conducting structures
Bitline contact plug formation method for flash memory manufacture, involves forming contact hole in inter-layered dielectric layer that covers conductive layer and fills gap between respective gate conducting structures
An inter-layered dielectric (ILD) layer (72) with planarized surface, is formed on a semiconductor substrate (50) comprising gate conducting structures, to cover a conductive layer and to fill gap between respective conducting structures. A bitline contact hole formed in the ILD layer, is filled with a conductive layer, to function as bitline contact plug.
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