Laser Flash Diffusivity Measurements of Filled Adhesive Effective thermal Conductivity and Contact Resistance Using Multilayer Methods

摘要

Thermal modeling of electronics packages requires accurate thermophysical property data for package materials. The ability to accurately predict the device junction temperature has become critical due to the increasing power and speed and decreasing size of semiconductor devices. Accurate data for the thermal resistance of the adhesive bondlines used in electronics packaging is critical because this thermal resistance can be a significant part of the total thermal resistance in the heat flow paths from the device junction to the package case or ambient.