首页> 外国专利> Production of a thin dielectric layer on a conducting substrate used in the semiconductor industry comprises applying a thin dielectric layer on the substrate, placing in an electrochemical cell, and applying an electrical potential

Production of a thin dielectric layer on a conducting substrate used in the semiconductor industry comprises applying a thin dielectric layer on the substrate, placing in an electrochemical cell, and applying an electrical potential

机译:在半导体工业中使用的导电基板上制造薄介电层包括在基板上施加薄介电层,放置在电化学电池中以及施加电势

摘要

Production of a thin dielectric layer (2) on a conducting substrate (1) comprises applying a thin dielectric layer on the substrate, placing in an electrochemical cell (5) filled with an electrolyte (9) and having two electrodes (6, 7), connecting the substrate with the first electrode and the second electrode with the electrolyte, and applying an electrical potential between the electrodes. The current flow between the electrolyte and substrate is controlled in an electrochemical process and is adjusted by the dielectric layer, preferably in the region of defect sites. An Independent claim is also included for an arrangement of a substrate and a dielectric layer.
机译:在导电基底(1)上制备薄介电层(2)包括在基底上施加薄介电层,放置在装有电解质(9)并具有两个电极(6、7)的电化学电池(5)中,将具有第一电极的基板和具有电解质的第二电极连接,并在电极之间施加电势。在电解质和基材之间的电流在电化学过程中被控制并且通过介电层被调节,优选在缺陷部位的区域中。还包括关于基板和介电层的布置的独立权利要求。

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