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Production of a thin dielectric layer on a conducting substrate used in the semiconductor industry comprises applying a thin dielectric layer on the substrate, placing in an electrochemical cell, and applying an electrical potential
Production of a thin dielectric layer on a conducting substrate used in the semiconductor industry comprises applying a thin dielectric layer on the substrate, placing in an electrochemical cell, and applying an electrical potential
Production of a thin dielectric layer (2) on a conducting substrate (1) comprises applying a thin dielectric layer on the substrate, placing in an electrochemical cell (5) filled with an electrolyte (9) and having two electrodes (6, 7), connecting the substrate with the first electrode and the second electrode with the electrolyte, and applying an electrical potential between the electrodes. The current flow between the electrolyte and substrate is controlled in an electrochemical process and is adjusted by the dielectric layer, preferably in the region of defect sites. An Independent claim is also included for an arrangement of a substrate and a dielectric layer.
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