Method and apparatus for performing sequential method, the different lengths of time is necessary, in the production of a semiconductor device

摘要

A method of manufacturing a semiconductor device contains a first and second method, wherein the latter requires a longer processing time. A device for carrying out of the half conductor production process includes a first reactor and a plurality of second reactors for each first reactor. A first group of wafers passes through the first process within the first reactor and is then transported in a second reactor, which is insulated with respect to the outside air. The first group of wafers, passes through the second method within the second reactor. For the same time passes through a second group of wafers the first method within the first reactor. After the first method has been completed, the second group of wafers are transported in one of the second reactors, which is not occupied, and specifically in a relative to the ambient air insulated state. There passes through the second group of wafers the second method. Accordingly, errors, which would otherwise occur due to the contact of the wafer with oxygen, for example, be caused in the air be minimized, and the productivity is in spite of the difference in the case of the processing times high.