Test system for integrated circuit chips has a sealing arrangement that attaches to the lower side of the test circuit board to prevent damage or interference due to frost during low temperature testing

摘要

Test system for integrated circuit chips has a test circuit board (130), a temperature control unit (120) and a test unit (110), suitable for determination of the properties of a number of integrated circuit chips. The chips under test are placed on the upper surface of the test circuit board. A sealing unit (140) is brought into contact with the second lower surface of the test circuit board to isolate at least a part of it against the surrounding air.