首页> 外国专利> A method for forming of objects with a high surface quality and dimensional accuracy of ceramic material.

A method for forming of objects with a high surface quality and dimensional accuracy of ceramic material.

机译:一种形成具有高表面质量和陶瓷材料尺寸精度的物体的方法。

摘要

A method for micromolding ceramic articles and structures having spatial features as small as 0.1 &mgr;m and having a depth ranging from 2. 0 &mgr;m to 100 &mgr;m. A master mold of the article or structure to be molded is first fabricated using a silicon wafer and dry etching technology. A negative master mold is then produced by placing the silicon master mold device in a surrounding mold form and filling the surrounding mold form with a silicone or silicone rubber, preferably an RTV™ (a room temperature-vulcanizing silicone rubber compound). Such material replicates each of the micro features of the master mold in great detail to a resolution on the order of 0.1 &mgr;m. The negative master mold is then used in a die to mold the desired individual elements or structures from a ceramic powder which is capable of replicating each of the micro features of the negative master mold to the desired resolution. Depending on the resolution required in a particular micromolded element, it may be necessary to use ceramic nano-particles in the micromolding process. For resolution of spatial features having dimensions as small as 0.1 &mgr;m and a depth of about 2.0 &mgr;m, ceramic nano-particles ranging in size from about 0.01 &mgr;m to about 0. 02 &mgr;m can be used to micromold these features. If an integral structure is to be created from multiple micromolded ceramic elements, the elements are first assembled prior to sintering. Sintering results in an integration of the assembled elements to form a contiguous structure. A single element, or alternatively, multiple elements can be molded simultaneously from the stone mold cavity preferably using a dry pressing process or, in the alternative, a cold isostatic pressing process.
机译:一种微成型陶瓷制品和结构的方法,该陶瓷制品和结构的空间特征小至0.1μm,深度范围为2. 0μm至100μm。首先使用硅晶片和干法蚀刻技术制造要模制的物品或结构的母模。然后通过将硅母模装置放置在周围的模具形式中并用硅酮或硅橡胶,优选是RTV™将其填充到周围的模具形式中,来制造阴模。 (室温硫化的硅橡胶混合物)。这种材料非常细致地复制了母模的每个微特征,使其分辨率达到了0.1 µm的数量级。然后,将阴模母模用在模具中,以从陶瓷粉末模制所需的单个元件或结构,该陶瓷粉末能够将阴模母模的每个微特征复制到所需的分辨率。根据特定微成型元件所需的分辨率,可能需要在微成型过程中使用陶瓷纳米颗粒。为了分辨尺寸小至0.1μm且深度约2.0μm的空间特征,可以使用尺寸范围从0.01μm至约0. 02μm的陶瓷纳米颗粒进行微成型。这些功能。如果要由多个微成型的陶瓷元件创建整体结构,则在烧结之前首先要组装这些元件。烧结导致组​​装的元件一体化以形成连续的结构。可以优选地使用干压工艺或替代地使用冷等静压工艺从石材模腔同时模制单个元件或多个元件。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号