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CERAMIC SUBSTRATE AND METHOD OF FORMING THIN FILM ON COARSE SURFACE OF CERAMIC SUBSTRATE

机译:陶瓷基质和在陶瓷基质的粗糙表面上形成薄膜的方法

摘要

PROBLEM TO BE SOLVED: To provide a ceramic substrate capable of forming a thin film with good adhesion on the surface of the ceramic substrate even if ceramic portions and metallic portions are mixed up in the same plane.;SOLUTION: The ceramic substrate comprises an AIN-made insulating substrate 2 and a metallic conductive layer 3, the surface roughness Ra1 of the insulating substrate 2 is determined to be 0.01 μm to 5 μm and the surface roughness Ra2 of the conductive layer 3 is determined to be 0.002 μm to 2 μm to allow the surface roughness Ra1 of the insulating substrate 2 to be bigger than that Ra2 of the conductive layer 3.;COPYRIGHT: (C)2004,JPO&NCIPI
机译:解决的问题:提供一种即使在同一平面上混合陶瓷部分和金属部分也能够在陶瓷衬底的表面上形成具有良好粘附性的薄膜的陶瓷衬底;解决方案:该陶瓷衬底包括AIN制成的绝缘基板2和金属导电层3,绝缘基板2的表面粗糙度Ra1被确定为0.01μm至5μm,并且导电层3的表面粗糙度Ra2被确定为0.002μm。 ;μm至2μm,以使绝缘基板2的表面粗糙度Ra1大于导电层3的表面粗糙度Ra2 。;版权:(C)2004,JPO&NCIPI

著录项

  • 公开/公告号JP2004260220A

    专利类型

  • 公开/公告日2004-09-16

    原文格式PDF

  • 申请/专利权人 IBIDEN CO LTD;

    申请/专利号JP20040175658

  • 发明设计人 SAEGUSA YOSHITAKA;ITO YASUTAKA;

    申请日2004-06-14

  • 分类号H05K3/38;H05K3/14;H05K3/18;

  • 国家 JP

  • 入库时间 2022-08-21 23:35:23

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