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FLEXIBLE EPOXY LAMINATED SUBSTRATE AND FLEXIBLE EPOXY PRINTED WIRING BOARD

机译:柔性环氧树脂层压基板和柔性环氧树脂印刷线路板

摘要

PROBLEM TO BE SOLVED: To provide a flexible epoxy laminated substrate having an excellent flexibility, and to provide an epoxy printed wiring board.;SOLUTION: The flexible epoxy laminated substrate comprises at least one layer of metal foil and at least one layer of insulator. The insulator has a curvature radius of 1 mm and can be bent. Especially, the insulator is such that a base material is impregnated with an epoxy resin composition which contains, as a hardener constituent, an acid anhydride system hardener including imide system oligomers which use imide units and have an acid anhydride group at an end, and then the epoxy resin composition is cured.;COPYRIGHT: (C)2004,JPO
机译:解决的问题:提供一种具有优异柔韧性的柔性环氧层压基板,并提供一种环氧印刷线路板。解决方案:该柔性环氧层压基板包括至少一层金属箔和至少一层绝缘体。绝缘体的曲率半径为1 mm,可以弯曲。特别地,绝缘体是用环氧树脂组合物浸渍基础材料,该环氧树脂组合物包含作为固化剂成分的酸酐体系固化剂,该酸酐体系固化剂包括使用酰亚胺单元并在末端具有酸酐基的酰亚胺体系低聚物,然后环氧树脂组合物的固化。;版权所有:(C)2004,日本特许厅

著录项

  • 公开/公告号JP2004014636A

    专利类型

  • 公开/公告日2004-01-15

    原文格式PDF

  • 申请/专利权人 UBE IND LTD;

    申请/专利号JP20020163309

  • 申请日2002-06-04

  • 分类号H05K1/03;B32B15/08;C08G59/42;C08J5/04;

  • 国家 JP

  • 入库时间 2022-08-21 23:33:40

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