STICKING DEVICE FOR ABRASIVE BLOCK AND METHOD FOR THE SAME, ABRASIVE DEVICE USING ABRASIVE MEMBER PRODUCED BY THE DEVICE OR THE METHOD, PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE USING ABRASIVE DEVICE AND SEMICONDUCTOR DEVICE PRODUCED BY PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a sticking device which prevents bubbles from being formed in a space between an abrasive pad (abrasive block) and a pad plate (polishing support) and sticks the abrasive pad on a sticking surface of the pad plate in a flat state, and also to provide a method used for the same.;SOLUTION: The sticking device 50 sticks the abrasive pad 40c on the sticking surface 40b of an abrasive member 4 comprising an abrasive pad 40c to abut with a surface to be polished of a semiconductor wafer W and carry out polishing, and a pad plate 40a having the sticking surface 40b on which the abrasive pad 40c is stuck and held flat. This sticking device 50 is provided with a support tool 70 for the abrasive pad 70 to suck the abrasive pad 40c and hold it in a flat state and an air cylinder 60. The support tool 70 for the abrasive pad is swingably supported by an lower end of a piston rod 62 of the air cylinder 60 and moved toward the sticking surface 40b with the air cylinder 60, and the support tool 70 for the abrasive pad presses the abrasive pad 40c held flat on the support tool 70 for the abrasive pad on the abrasive surface 40b and stick it thereon.;COPYRIGHT: (C)2004,JPO