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ELECTRICAL CHARACTERISTIC MEASURING DEVICE AND ELECTRICAL CHARACTERISTIC MEASURING METHOD OF SEMICONDUCTOR DEVICE

机译:半导体装置的电气特性测量装置和电气特性测量方法

摘要

PROBLEM TO BE SOLVED: To surely bring two measuring contacts into contact with a lead terminal without being influenced by size dispersion of the lead terminal.;SOLUTION: This device is equipped with a first measuring contact 5 to be brought into contact with the lower surface of the lead terminal 3, and a second measuring contact 7 to be brought into contact with the outside side surface of a vertical part of the lead terminal 3, relative to one lead terminal 3 of a semiconductor device 1 equipped with the lead terminal 3 drawn out from the package side surface in the horizontal direction and bent vertically. Hereby, the two measuring contacts 5, 7 can be brought into contact with the lead terminal 3 without being influenced by the size dispersion of the lead terminal 3.;COPYRIGHT: (C)2004,JPO
机译:解决的问题:确保两个测量触点与一个引线端子接触,而不受引线端子的尺寸分布的影响。解决方案:此设备配备有一个要与下表面接触的第一测量触点5相对于配备有引出端子3的半导体装置1的一个引出端子3,第二引出端子7与引出端子3的垂直方向的外侧表面相接。从包装侧面沿水平方向伸出并垂直弯曲。因此,两个测量触点5、7可以与引线端子3接触,而不受引线端子3的尺寸分布的影响。;版权所有:(C)2004,JPO

著录项

  • 公开/公告号JP2004150981A

    专利类型

  • 公开/公告日2004-05-27

    原文格式PDF

  • 申请/专利权人 RICOH CO LTD;PARUMEKKU:KK;

    申请/专利号JP20020317409

  • 发明设计人 SUZUKI HIDENOBU;NAKAGAWA JUNICHI;

    申请日2002-10-31

  • 分类号G01R31/26;

  • 国家 JP

  • 入库时间 2022-08-21 23:32:41

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