首页> 外国专利> METHOD OF MANUFACTURING THREE-DIMENSIONAL METAL-INSULATOR-METAL CAPACITOR FOR DYNAMIC RANDOM ACCESS MEMORY(DRAM) AND FERROELECTRIC RANDOM ACCESS MEMORY(FERAM)

METHOD OF MANUFACTURING THREE-DIMENSIONAL METAL-INSULATOR-METAL CAPACITOR FOR DYNAMIC RANDOM ACCESS MEMORY(DRAM) AND FERROELECTRIC RANDOM ACCESS MEMORY(FERAM)

机译:动态随机存取存储器(DRAM)和铁电随机存取存储器(FERAM)的三维金属-绝缘-金属电容器的制造方法

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a metal-insulator-metal(MIM) capacitor provided with an insulator having a high dielectric constant or a ferroelectric interelectrode film conformable to a double damascene modus.;SOLUTION: A method of integrating the MIM by the double damascene modus comprises the steps of: forming a first plane insulating layer 20 and depositing an etching stop layer 22 and a second insulating layer 24; etching a capacitor node contacts opening 1 against a substrate; and etching a first recess 2 against the etching stop layer 22. A conductive layer 26 is filled in the contacts opening and the first recess by using the double damascene modus. A second recess 3 is formed around the capacitor node contacts on the second insulating layer. A first conformation metal layer 28, an interelectrode dielectric layer 30 and a second metal layer 32 are deposited and simultaneously patterned to form a capacitor upward the node contacts. The second recess increases a capacitor area, while patterning the metal layer, resulting in decreased treatment step.;COPYRIGHT: (C)2004,JPO&NCIPI
机译:解决的问题:提供一种制造金属-绝缘体-金属(MIM)电容器的方法,该电容器具有高介电常数的绝缘体或符合双镶嵌模式的铁电极间膜。双镶嵌方式的MIM包括以下步骤:形成第一平面绝缘层20,并沉积蚀刻停止层22和第二绝缘层24;蚀刻电容器节点使开口1紧贴衬底。并在蚀刻停止层22上蚀刻第一凹槽2。通过使用双镶嵌方式将导电层26填充在接触开口和第一凹槽中。在第二绝缘层上的电容器节点触点周围形成第二凹部3。沉积第一构象金属层28,电极间介电层30和第二金属层32,并同时对其进行构图,以在节点触点上方形成电容器。第二个凹槽增加了电容器的面积,同时对金属层进行了图案化,从而减少了处理步骤。;版权所有:(C)2004,JPO&NCIPI

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