ELECTRONIC PART MOUNTED SUBSTRATE, ELECTRO-OPTIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC PART MOUNTED SUBSTRATE AND ELECTRO-OPTIC DEVICE AND ELECTRONIC UNIT

摘要

PROBLEM TO BE SOLVED: To easily and quantitatively detect the connected state when the terminals on a board are electrically connected by using ACF.;SOLUTION: In a connection part where wiring arranged on a flexible printed board by a COF mounting system is connected with the wiring arranged on a printed circuit board by an SMT mounting system by thermocompression bonding, an inspection pattern for evaluating the electric connection is disposed on one board. A prober is brought into contact with the pattern so as to detect the resistance value. Thus, the connected state of the boards can quantitatively be inspected, and reliability of inspection can be improved and uniformized.;COPYRIGHT: (C)2004,JPO