HALOGEN-FREE FLAME RETARDANT EPOXY RESIN COMPOSITION, AND PREPREG, LAMINATED BOARD, COPPER-CLAD LAMINATED BOARD AND PRINTED CIRCUIT BOARD CONTAINING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a halogen-free flame retardant resin composition widely improved with a through-hole reliability by performing a stress relaxation of the resin layer of a printed circuit board and also excellent in cost performance.;SOLUTION: This halogen-free flame retardant epoxy resin composition used for the production of a laminated article is provided by using (A) a condensed phosphoric acid ester such as of resorcinol, etc., and (B) a bisphenol-based novolac type epoxy resin compound such as a bisphenol A novolac type epoxy resin, etc., as indispensable components. The prepreg is obtained by impregnating a substrate including a glass substrate with the epoxy resin composition. The prepreg is obtained by impregnating a substrate including a totally aromatic polyester-based nonwoven substrate with an epoxy resin composition. The laminated board, copper-clad laminated board and printed circuit board are produced by using the prepregs.;COPYRIGHT: (C)2004,JPO