首页> 外国专利> From the ultraviolet ray territory the back illumination type picture formation vessel which has the strengthening sensitivity to the near infrared rays territory

From the ultraviolet ray territory the back illumination type picture formation vessel which has the strengthening sensitivity to the near infrared rays territory

机译:从紫外线区域到对近红外线区域具有增强敏感性的背照式成像容器

摘要

As for this invention the back illumination type image array device (10) and there is a method of producing its device. This device (10), usually, array circuitry layer (16) with front layer (14) with quartz layer (12) with it consists of. Array circuitry layer (16) front layer (14) it is demarcated to the surface of one side. Quartz layer (12) front layer (14) it is provided on the other surface. The method of producing this device usually consists of the below-mentioned process. Thick silicon layer (32), thick silicon layer (32) oxide layer above (34) and oxide layer (34) front silicon layer above (36) the wafer which it has (30) it offers this method. Front silicon layer (36) it approaches the 2nd surface to oxide layer with the 1st and 2nd surface. Array circuitry layer is formed to the 1st surface layer of front silicon layer. The array circuit (24) temporary layer (40) is provided on the surface. Thick silicon layer (32) and oxide layer (34) the wafer (30) from it is removed, it makes the 2nd surface of front silicon layer expose with that. Quartz layer is formed to the 2nd surface. Temporary layer (40) it is removed from the array surface.
机译:关于本发明,存在背照式图像阵列装置(10)及其制造方法。该装置(10)通常由阵列电路层(16)和具有石英层(12)的前层(14)组成。阵列电路层(16)的前层(14)被划界到一侧的表面。石英层(12)的前层(14)设置在另一表面上。该装置的制造方法通常由以下的工序构成。提供具有该方法的厚硅层(32),厚硅层(32),位于(36)晶片上方的氧化物层(34)和位于(36)上方的氧化物层(34)的前硅层。前硅层(36)靠近第二表面,形成具有第一和第二表面的氧化层。在前硅层的第一表面层上形成阵列电路层。阵列电路(24)临时层(40)设置在表面上。从其上去除晶片(30)的厚硅层(32)和氧化层(34),由此使前硅层的第二表面暴露出来。在第二面形成有石英层。将其从阵列表面移除的临时层(40)。

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