Formation die and resin mold formation modulo for resin mold of lead/read frame assembly body

摘要

PROBLEM TO BE SOLVED: To enhance the productivity of a semiconductive device by forming resin burr in a state of being integrated with a runner resin and preventing the falling of the resin burr. SOLUTION: First and second molds forming a plurality of cavities having a complementary shape with respect to a resin seal element 5a, a runner 13 for guiding the flow of a fluidized resin and the gate 14 connecting the runner 13 and the cavities 5, a groove part 18 in which a connection lead 16 is arranged and the gap part 19 formed along the connection lead 16 when the connection lead 16 is arranged in the groove part 18 and connected to the runner 13 are provided in a mold for a resin mold. When the connection lead 16 is arranged in the groove part 18, the gap part 19 connected to the runner 13 is formed along the connection lead 16 and the groove resin 19a formed in the gap part 19 is integrally formed along with a runner resin 13a. The groove resin 19a is strongly fixed to the connection lead 16 and does not fall from the connection lead 16 so far as it is not forcibly removed.