Method for evaluating connection performance of wiring board, evaluation kit for the method, and wiring board

摘要

PROBLEM TO BE SOLVED: To evaluate connectivity of a wiring board with various sizes at a low cost. SOLUTION: A PCB test piece 10 having a first wiring pattern 11 which is formed intermittently along the entire length of a virtual spiral WL, and an LGA test piece 20 having a second wiring pattern 21 which is formed intermittently along entire length of a virtual spiral WL are prepared. By connecting the first and second wiring patterns 11, 12 each other electrically through solder or others, an assembly A20 in which an electric circuit WC1 is formed over the entire length of a virtual spiral WL is produced. By performing heat cycle experiment for the assembly A20, and checking variation of conductive condition between a common terminal 14 and an inspection terminal 15 of the electric circuit WC1 for each cycle, connection reliability is evaluated.