Board wave ultrasonic crack inspect manner and its device

摘要

PROBLEM TO BE SOLVED: To prevent defects from being left undetected due to level insufficiency and stably detect defects of the same level over a full length by multiplying and binarizing detection signals when an edge reflection wave part is lower in level than a reference signal. ;SOLUTION: When a pulser 2 applies a predetermined voltage to a tire probe 11 in accordance with a pulse signal from a pulse timing controller 3, the probe 11 oscillates ultrasonic waves. The ultrasonic waves are reflected by a defect or an edge E of a material S to be inspected, and detected by the probe 11. The detection signal is amplified by a signal amplifier 4 and converted to a digital signal by an A/D converter 6 via a band pass filter 5. The digital signal of the material S to be inspected and the pulse signal from the controller 3 are arranged sequentially in a transfer direction and stored in a mapping memory 7. The stored two-dimensional inspection signal is converted by an operation part 9 and input to an image memory 8. Information such as a position of the defect, etc., is calculated from the inspection image at the operation part.;COPYRIGHT: (C)1999,JPO