High density multilayer printed wiring board and a high-density multilayer printed wiring board for single-sided circuit board

摘要

PROBLEM TO BE SOLVED: To provide an effective technique for manufacturing a multilayer printed wiring board with an interstitial via hole structure effectively at high yield.;SOLUTION: In single-sided circuit boards (7a, 7b) for a multilayer printed wiring board: conductor circuits (3a, 3b) are provided to one surface of insulating hard substrates (2a, 2b) composed of a single-sided copper clad laminated plate; adhesive layers (4a, 4b) are provided covering the conductor circuit; a hole reaching the conductor circuit is provided to the other surface of the substrate; and via holes (6a, 6b) filled with conductive paste 5 in the hole to project from the substrate are provided. A multilayer printed wiring board 1 of an IVH structure is manufactured effectively at high yield by using the single-sided circuit boards (7a, 7b).;COPYRIGHT: (C)2003,JPO